Ultra-high Vacuum Cryopumps for Semiconductor & Research
Cryopumps operate by condensing or adsorbing gas molecules on a cold head at low temperatures, achieving ultra-high vacuum. Hynhe cryopumps feature high pumping speed and ultimate vacuum performance. The multi-stage cold head captures different gas species at progressively lower temperatures: water vapor and hydrocarbons at the 55K stage, while nitrogen, oxygen, and argon are captured at the 9K stage. Hydrogen, helium, and neon are adsorbed on activated charcoal at the lowest temperature stage.
Hynhe cryopumps deliver ultra-high vacuum performance for semiconductor wafer processing, thin film deposition, electron microscopy, mass spectrometry, and space simulation chambers. Each pump is designed for maximum pumping speed with minimal vibration and fast regeneration cycles.
Compact cryopump with CF200 flange interface, delivering ultra-high vacuum down to 10-7 Pa. The CP-8L features dual-stage cooling at 55K and 9K for efficient capture of all gas species. Its high pumping speed for small molecules makes it ideal for semiconductor etching and deposition processes where rapid gas removal is critical.
Versatile cryopump featuring a CF250 flange for medium-scale vacuum chambers. The CP-10L delivers high pumping speed with excellent hydrogen capacity, making it well-suited for semiconductor manufacturing tools and research vacuum systems requiring reliable high-throughput operation.
Large-capacity cryopump with CF320 flange for bigger vacuum chambers. The CP-12L provides substantial pumping capacity for large semiconductor process tools, coating systems, and research chambers. Its extended cryopanel surface area delivers higher gas throughput and longer operating cycles between regenerations.
Extra-large port cryopump featuring a CF400 flange for the largest vacuum systems. The CP-16H delivers maximum pumping speed and throughput capacity for demanding industrial coating systems, large-scale space simulation chambers, and high-volume semiconductor manufacturing equipment.
High-capacity cryopump with ISO630 flange and dual cryocooler configuration. The CP-630H achieves 10-7 Pa ultimate vacuum with exceptional pumping speed for all gas species. The dual-cooler design provides redundant cooling capacity and extended maintenance intervals for continuous industrial operation.
Our ultra-high vacuum flagship cryopump achieving an exceptional 2×10-9 Pa with baking. The CT-300UHV represents the pinnacle of cryopump technology, designed for the most demanding UHV applications including surface science research, particle accelerator beam lines, and quantum device fabrication.
Fully integrated cryopump system combining pump and compressor in a single turnkey package. The CPM12L+NV77 simplifies installation and operation by integrating all components into one optimized system. Ideal for customers seeking a complete, ready-to-run vacuum solution without the complexity of separate component integration.
Wafer etching, deposition, and ion implantation processes requiring clean ultra-high vacuum environments.
Optical coating, protective film deposition, and industrial PVD/CVD processes.
Electron microscopy, mass spectrometry, surface analysis, and particle physics experiments.
Thermal vacuum chambers for satellite and spacecraft component testing.
Our engineering team can design a cryopump system tailored to your specific vacuum requirements, chamber size, and process conditions.
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